| Reliability Testing of Automotive Products (in compliance with AEC-Q102 standard) | ||||||||
| NO | Abbreviation | Test Item | Test Standard | Test Condition | Test Period | Test Equipment | Sample Quantity | Acceptance Criteria |
| Test Group A - Accelerated Environmental Stress Testing | ||||||||
| 1 | PC | Pre-conditioning | JEDEC JESD22-A113 | 125℃/24 hrs, 60℃/60%RH, 120hrs ,3X reflow | 144 hrs | Humidisat Tester Reflow Oven | 312pcs | Zero defect |
| 2 | WHTOL1 | Wet HighTemperatureOperating Life1 | JEDEC JESD22-A101 | Ta=85℃,RH=85% 30min on/30min off; | 1000 hrs | Humidisat Tester | 26pcs | Zero defect |
| 3 | WHTOL2 | Wet HighTemperatureOperating Life2 | JEDEC JESD22-A101 | Ta=85℃,RH=85% | 1000 hrs | Humidisat Tester | 26pcs | Zero defect |
| 4 | PTC | Power Temperature Cycling | JEDEC JESD22-A105 | Ta=-40℃/85℃、100℃、125℃ 5min on/5min off; Convert for 10 minutes and stay for 20 minutes | 1000 cycles | Temperature shock testing chamber | 26pcs | Zero defect |
| 5 | TC | Temperature Cycling | JEDEC JESD22-A104 | Ta=-40℃/85℃、100℃、110C、125℃、150℃ Conversion time < 10 seconds, stay time 15 minutes | 1000 cycles | Temperature shock testing chamber | 26pcs | Zero defect |
| Test Group B - Accelerated Life Testing | ||||||||
| 6 | HTOL1 | High Temperature OperatingLife1 | JEDEC JESD22-A108F-2017 | Ta=Tjmax 85℃、105℃、125℃ The maximum current corresponding to the maximum current value in the reduction curve under the highest allowable operating temperature condition | 1000 hrs | High Temperature Tester | 26pcs | Zero defect |
| 7 | HTOL2 | High Temperature OperatingLife2 | JEDEC JESD22-A108F-2017 | Ta=Tjmax 85℃、105℃、125℃ Under the rated driving current condition, based on the maximum temperature corresponding to the reduction curve | 1000 hrs | High Temperature Tester | 26pcs | Zero defect |
| 8 | PLT | Pulsed Life | JEDEC JESD22-A108F-2017 | Ta=55℃, Current: Refer to the specification for pulse current, with a pulse width of 100 seconds and a duty cycle of 3%. | 1000 hrs | High Temperature Tester | 26pcs | Zero defect |
| Test Group C - Package Assembly Integrity Test | ||||||||
| 9 | DPA | Destructive Physical Analysis | AEC-Q102:2020 | A random sample of the experiments that have been successfully completed The project's materials are provided along with reference pictures. | 1 day | Microscope | 16pcs | Zero defect |
| 10 | PD | Physical Dimension | JESD22-B100B-2003 | Measure the external physical dimensions of the LED by Microscope | 1 day | Microscope | 10pcs | Zero defect |
| 11 | WBP | Wire Bond Pull | MIL-STD-750-2A w/CHANGE 4:2020 | Test Speed: 300 μm/s | 1 day | Thrust Tensile tester | 10pcs | Cpk > 1.67 |
| 12 | WBS | Wire Bond Shear | JEDEC JESD22-B116B-2017 | Shear Speed: 300 μm/s,Shear Height: 2 μm | 1 day | Thrust Tensile tester | 10pcs | Cpk > 1.67 |
| 13 | DS | Die Shear | MIL-STD-750-2A w/CHANGE 4:2020 | Shear Speed: 300 μm/s,Shear Height: 50 μm | 1 day | Thrust Tensile tester | 5pcs | Cpk > 1.67 |
| 14 | DEW | Dew | AEC-Q102-001:2020 | Rated current is connected, 65hrs | 3 day | Humidisat Tester | 26pcs | Zero defect |
| 15 | TR | Thermal resistance | JESD51-50-2012 | Test the thermal resistance value of heat conduction from the chip to the baseplate. | 1 day | Heat resistance testing machine | 10pcs | Zero defect |
| 16 | SD | Solderability | EIA/IPC/JEDEC J-STD-002E-2017 | Test type:Pb-free solderability Pretreatment Conditions:155℃,4 hours Oven:250℃,3min | 1 day | Reflow Oven | 10pcs | Zero defect |
| 18 | H2S | Hydrogen Sulphide | IEC60068-2-43:2003 | Ta=40℃ RH=90%, H2S concenteation:15x 10-6 | 336 hrs | Sulfurization testing machine | 26pcs | Zero defect |
| 19 | FMG | Flowing Mixed Gas | IEC 60068-2-60:2015 | Ta=25℃ RH=75% H2Sconcenteation:10 × 10-9 S02concenteation:200 × 10-9 NOconcenteation:200 × 10-9 CI2concenteation:10 × 10-9 | 500 hrs | Hybrid gas testing machine | 26pcs | Zero defect |
| 20 | BF | Board Flex | AEC-Q102-002-Rev-2020 | Testing speed:50mm/min Span:90mm Radius of loading and supports edge:10mm Compress 2mm and keep 5s Status:Powered on | 1 day | Bending testing machine | 10pcs | Zero defect |
| Test Group D - Photoelectrical Characteristics Verification Test | ||||||||
| 21 | EV | External Visual | JEDEC JESD22-B101C-2015 | Visual inspection | 1 day | (≥100x) Optical microscope | 702pcs | Zero defect |
| 22 | TEST | Pre-and Post-Stress Electrical and Photometric Test | AEC-Q102-Rev_A-2020 | Measure Vf,Φv,Cx,Cy,at | 1 day | Integral ball tester | 702pcs | Zero defect |
| 23 | PV | Parametric Verification | Client's specification | Test Temp,:-40℃,100℃ Test all parameters | 1 day | Power tester | 30pcs | Zero defect |
| 24 | HBM | Electrostatic Discharge Human Body Model | ANSI/ESDA/JEDEC JS-001-2017 | HBM≥8000V | 1 day | Antistatic tester | 30pcs | Zero defect |
| 25 | CDM | Electrostatic Discharge Charged Device Model | AEC-Q101-005-REV-A-2019 | CDM≥800V | 1 day | Antistatic tester | 30pcs | Zero defect |
| Test Group E - Package Assembly Integrity Test | ||||||||
| 26 | VVF | Vibration Variable Frequency | JEDEC JESD22-B103B.01:2016 | Frequency Range:(20Hz-2000Hz) Amplitude(p-p): 1.5 mm (20Hz-80Hz) Acceleration:20g (80Hz-2000Hz)Sweep Rate:4Min/cycle Orientation: Xaxis,Yaxis,Zaxis 4cycles | 1 day | Vibration measurement instrument | 30pcs | Zero defect |
| 27 | MS | Mechanical Shock | JEDEC JESD22-B110B01:2019 | Pulse Shape:Half-sine Acceleration:1500g,Pulse Width:0.5 ms Orientation: Xaxis,Yaxis,Zaxis Shock Times: 5times/direction,total 30 times | 1 day | lmpact testing apparatus | 30pcs | Zero defec |