Main Purpose:

High temperature and high humidity storage experiment, high temperature and high humidity electrical test

Function Description:

Verify the stability of product storage and operation under high temperature and humidity

Main Purpose:

Cold and hot shock experiment, temperature cycle experiment, temperature cycle experiment.

Function Description:

Verify the stability of storage and operation of the product in the environment of alternating limit temperature change.

Main purpose:

Cold and hot shock test.

Function Description:

Verify the mechanical stress tolerance of the product under extreme temperature changes at high and low temperatures.

Main Purpose:

Reflow soldering and heat resistance test.

Function Description:

Reflow soldering is the process of sending the PCB installed on the SMT reflow soldering chamber to melt the solder paste used for soldering the SMT element through high temperature to form the reflow of the temperature change. In addition, when the external reflow soldering machine reaches the required temperature, the heat resistance and tin loading capacity of the product can be verified.

Main Purpose:

High temperature storage experiment, high temperature electrification experiment

Function Description:

Verify the stability of product storage and operation under continuous high temperature environment

Main Purpose:

Low temperature storage experiment, low temperature electrification experiment.

Function Description:

Verify the stability of product storage and operation under continuous low temperature environment.

Main Purpose:

Checking whether the various dimensions of raw materials and products meet the requirements

Function Description:

Used for measuring two-dimensional plane dimensions, including diameter, radius, and length

Main Purpose:

Check whether all parts such as the plates, brackets and others meet the requirements.

Function Description:

X-ray detector is used to quickly detect the object under the premise of not damaging it. The X-ray penetration is generated by high-voltage impact on target and also used to detect the quality of electronic components, the internal structure of semiconductor packaging products, and the welding quality of all types of SMT welding spots.

Main Purpose:

XRF is a non-destructive detection method, which can quickly obtain the detection value. According to the characteristics of each element, X-ray intensity can be measured to determine the content of elements.

Function Description:

Check whether raw materials and products ROHS avoid hazardous materials and  meet  all the requirements.

Main Purpose:

Measure and analyze the products, take photos by 3D synthesis, etc.

Function Description:

KEYENCE features high definition, wide viewing angles, measuring inch methods, area, 3D depth contract measurement, maximum magnification of 1000 times, high definition, and 3D composite photographing.

Main Purpose:

Verify that product parameters meet customer's  requirements.

Function Description:

The parameters such as LED intensity, spatial intensity distribution curve, central intensity and beam angle are accurately measured.

Main Purpose:

Verify that product parameters meet customer's  requirements.

Function Description:

Measure LED relative spectral power distribution Pλ, chromaticity coordinates (x,y),(u,v), correlation color temperature Tc, Color rendering index Ra, color tolerance SDCM, peak wavelength λp, spectral half-width △λ, main wavelength λd, color purity , luminous flux lm, luminous intensity (with test standard), luminous effect, forward voltage, reverse leakage current and other photochromic performance parameters.

Main Purpose:

Verify that product parameters meet customer's requirements.

Function Description:

Testing the performance parameters of LED infrared receiver such as dark current, photocurrent, sensitivity, response time and so on.

Main Purpose:

Verify the anti-static ability of the product.

Function Description:

Test LED voltage resistance, mechanical mode (MM) + 100V ~ 800V, human mode (HBM) + 1000V ~ 8000V, MM - HBM & HBM - MM multiple cycle mode test can be set.

Main Purpose:

Room Temperature Constant Current Experiment, Pulse Current Experiment.

Function Description:

Verify the stability of the product in continuous operation at normal temperature.

Main Purpose:

Room Temperature Constant Current Experiment, Pulse Current Experiment.

Function Description:

Verify the stability of the product in continuous operation at normal temperature.

Main Purpose:

Tin test and heat resistance test.

Function Description:

The main purpose of our company is to test the tin loading capacity of the product. At the same time, the heat resistance of the product can be tested when the furnace is adjusted to the required temperature in the experiment.

Main Purpose:

Red ink experiment, product glue experiment, PCB board welding and welding LED lamp, etc.

Function Description:

It is used for soldering and welding of PCB patch parts. It has the characteristics of high thermal conductivity, fast heating, uniform heating, etc. It can be used for heating samples at constant temperature and other temperature tests.

Main Purpose:

Salt spray experiment

Function Description:

Salt spray corrosion is used to detect the samples and evaluate the ability of layer surface to resist the corrosion itself.

Main Purpose:

Vibration experiment.

Function Description:

Verify that the product meets customer's specifications in various vibration environments during transportation, installation and use.

Main Purpose:

Shock experiment

Function Description:

Verify the extent of damage to the product caused by the impact force produced when in collision, bouncing or falling.